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SI7997DP_15 Datasheet, PDF (2/14 Pages) Vishay Siliconix – Dual P-Channel 30 V (D-S) MOSFET
Si7997DP
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
Dynamicb
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
VDS
VDS/TJ
VGS(th)/TJ
VGS(th)
IGSS
IDSS
ID(on)
RDS(on)
gfs
VGS = 0 V, ID = - 250 µA
ID = - 250 µA
VDS = VGS, ID = - 250 µA
VDS = 0 V, VGS = ± 20 V
VDS = - 30 V, VGS = 0 V
VDS = - 30 V, VGS = 0 V, TJ = 55 °C
VDS - 5 V, VGS = - 10 V
VGS - 10 V, ID = - 20 A
VGS - 4.5 V, ID = - 20 A
VDS = - 15 V, ID = - 20 A
Ciss
Coss
Crss
Qg
VDS = - 15 V, VGS = 0 V, f = 1 MHz
VDS = - 15 V, VGS = - 10 V, ID = - 20 A
Gate-Source Charge
Qgs
VDS = - 15 V, VGS = - 4.5 V, ID = - 20 A
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Qgd
Rg
td(on)
f = 1 MHz
Rise Time
Turn-Off Delay Time
tr
td(off)
VDD = - 15 V, RL = 1.5 
ID  - 10 A, VGEN = - 4.5 V, Rg = 1 
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
tf
td(on)
tr
td(off)
VDD = - 15 V, RL = 1.5 
ID  - 10 A, VGEN = - 10 V, Rg = 1 
Fall Time
tf
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
IS
TC = 25 °C
Pulse Diode Forward Currenta
ISM
Body Diode Voltage
VSD
IS = - 10 A
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Qrr
ta
IF = - 10 A, dI/dt = 100 A/µs, TJ = 25 °C
Reverse Recovery Rise Time
tb
Notes:
a. Pulse test; pulse width  300 µs, duty cycle  2 %
b. Guaranteed by design, not subject to production testing.
Min.
- 30
- 1.0
- 20
0.9
Typ. Max. Unit
- 23
5
0.0045
0.0063
71
- 2.2
± 100
-1
- 10
0.0055
0.0078
V
mV/°C
V
nA
µA
A

S
6200
615
pF
560
106
160
51
77
nC
17
16.5
4.6
9.2

60
90
50
75
80
120
40
60
ns
15
25
10
15
115
175
40
60
- 38
A
- 100
- 0.8
- 1.2
V
35
55
ns
30
45
nC
15
ns
20
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 66719
S10-1826-Rev. A, 09-Aug-10