SI7236DP Datasheet, PDF (2/13 Pages) Vishay Siliconix – Dual N-Channel 20-V (D-S) MOSFET

Si7236DP
Vishay Siliconix
SPECIFICATIONS T_J = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Static
Drain-Source Breakdown Voltage
V_DS
V_GS = 0 V, I_D = 250 µA
V_DS Temperature Coefficient
V_GS(th) Temperature Coefficient
Gate-Source Threshold Voltage
ΔV_DS/T_J
ΔV_GS(th)/T_J
V_GS(th)
I_D = 250 µA
V_DS = V_GS , I_D = 250 µA
Gate-Source Leakage
I_GSS
V_DS = 0 V, V_GS = ± 12 V
Zero Gate Voltage Drain Current
On-State Drain Current^a
I_DSS
I_D(on)
V_DS = 20 V, V_GS = 0 V
V_DS = 20 V, V_GS = 0 V, T_J = 55 °C
V_DS ≥ 5 V, V_GS = 4.5 V
Drain-Source On-State Resistance^a
Forward Transconductance^a
Dynamic^b
R_DS(on)
g_fs
V_GS = 4.5 V, I_D = 20.7 A
V_GS = 2.5 V, I_D = 17.9 A
V_DS = 10 V, I_D = 20.7 A
Input Capacitance
C_iss
Output Capacitance
C_oss
V_DS = 10 V, V_GS = 0 V, f = 1 MHz
Reverse Transfer Capacitance
C_rss
Total Gate Charge
Q_g
V_DS = 10 V, V_GS = 10 V, I_D = 20 A
Gate-Source Charge
Q_gs
Gate-Drain Charge
Q_gd
Gate Resistance
R_g
Turn-on Delay Time
t_d(on)
Rise Time
t_r
Turn-Off Delay Time
t_d(off)
Fall Time
t_f
Turn-on Delay Time
t_d(on)
Rise Time
t_r
Turn-Off Delay Time
t_d(off)
Fall Time
t_f
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I_S
Pulse Diode Forward Current
I_SM
Body Diode Voltage
V_SD
Body Diode Reverse Recovery Time
t_rr
Body Diode Reverse Recovery Charge
Q_rr
Reverse Recovery Fall Time
t_a
Reverse Recovery Rise Time
t_b
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing.
V_DS = 10 V, V_GS = 4.5 V, I_D = 20 A
f = 1 MHz
V_DD = 10 V, R_L = 1 Ω
I_D ≅ 10 A, V_GEN = 4.5 V, R_g = 1 Ω
V_DD = 10 V, R_L = 1 Ω
I_D ≅ 10 A, V_GEN = 10 V, R_g = 1 Ω
T_C = 25 °C
I_S = 10 A, V_GS = 0 V
I_F = 10 A, dI/dt = 100 A/µs, T_J = 25 °C
Min.
20
0.6
20
Typ. Max. Unit
19
- 4.3
0.042
0.0056
120
1.5
± 100
1
10
0.0052
0.007
V
mV/°C
V
nA
µA
A
Ω
S
4000
650
pF
300
68
105
31
47
nC
7.5
5
3.5
Ω
30
45
100
150
80
120
22
35
ns
10
15
15
25
60
90
10
15
60
A
80
0.8
1.2
V
40
80
ns
30
60
nC
19
ns
21
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 70359
S09-0222-Rev. B, 09-Feb-09