DG636 Datasheet, PDF (2/10 Pages) Vishay Siliconix – 0.5 pC Charge Injection, 100 pA Leakage, Dual SPDT Analog Switch

DG636
Vishay Siliconix
TRUTH TABLE
Enable
Input
L
H
H
H
H
New Product
Selected Input
A1
A0
X
X
L
L
L
H
H
L
H
H
On Switches
DG636
All Switches Open
D1 to S1A, D2 to S2A
D1 to S1B, D2 to S2A
D1 to S1A, D2 to S2B
D1 to S1B, D2 to S2B
ORDERING INFORMATION
Temp. Range
- 40 °C to 125 °C^a
Notes:
a. - 40 °C to 85 °C datasheet limits apply.
Package
14-Pin TSSOP
16-Pin miniQFN
Part Number
DG636EQ-T1-E3
DG636EN-T1-E4
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Limit
V+ to V-
14
GND to V-
7
Digital Inputs^a, V_S, V_D
(V-) - 0.3 to (V+) + 0.3
or 30 mA, whichever occurs first
Continuous Current (Any Terminal)
30
Peak Current, S or D (Pulsed 1 ms, 10 % Duty Cycle)
100
Storage Temperature
- 65 to 150
Power Dissipation (Package)^b
14-Pin TSSOP^c
16-Pin miniQFN^{d, e}
450
525
Thermal Resistance (Package)^b
14-Pin TSSOP
16-Pin miniQFN
178
152
Unit
V
mA
°C
mW
°C/W
Notes:
a. Signals on SX, DX, or INX exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
b. All leads welded or soldered to PC board.
c. Derate 5.6 mW/°C above 70 °C.
d. Derate 6.6 mW/°C above 70 °C.
e. Manual soldering with iron is not recommended for leadless components. The miniQFN-16 is a leadless package. The end of the lead terminal
is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper lip cannot be
guaranteed and is not required to ensure adequate bottom side solder interconnection.
www.vishay.com
2
Document Number: 69901
S-80239-Rev. B, 04-Feb-08