SI7540ADP Datasheet, PDF (14/18 Pages) Vishay Siliconix – N-and P-Channel 20 V (D-S) MOSFET

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Application Note AN821
Vishay Siliconix
PowerPAK^® SO-8 Mounting and Thermal Considerations
PowerPAK SO-8 DUAL
The pin arrangement (drain, source, gate pins) and the pin
dimensions of the PowerPAK SO-8 dual are the same as
standard SO-8 dual devices. Therefore, the PowerPAK
device connection pads match directly to those of the SO-8.
As in the single-channel package, the only exception is the
extended drain connection area. Manufacturers can likewise
take immediate advantage of the PowerPAK SO-8 dual
devices by mounting them to existing SO-8 dual land
patterns.
To take the advantage of the dual PowerPAK SO-8’s
thermal performance, the minimum recommended land
pattern can be found in Application Note 826,
Recommended Minimum Pad Patterns With Outline
Drawing Access for Vishay Siliconix MOSFETs. Click on the
PowerPAK 1212-8 dual in the index of this document.
The gap between the two drain pads is 24 mils. This
matches the spacing of the two drain pads on the
PowerPAK SO-8 dual package.
REFLOW SOLDERING
Vishay Siliconix surface-mount packages meet solder reflow
reliability requirements. Devices are subjected to solder
reflow as a test preconditioning and are then
reliability-tested using temperature cycle, bias humidity,
HAST, or pressure pot. The solder reflow temperature profile
used, and the temperatures and time duration, are shown in
figures 3 and 4.
For the lead (Pb)-free solder profile, see
www.vishay.com/doc?73257.
Fig. 3 Solder Reflow Temperature Profile
Ramp-Up Rate
Temperature at 150 - 200 °C
Temperature Above 217 °C
Maximum Temperature
Time at Maximum
Temperature
Ramp-Down Rate
+ 3 °C /s max.
120 s max.
60 - 150 s
255 + 5/- 0 °C
30 s
+ 6 °C/s max.
150 - 200 °C
260 °C
3 °C(max)
30 s
217 °C
60 s (min.)
Pre-Heating Zone
150 s (max.)
Reflow Zone
Maximum peak temperature at 240 °C is allowed.
6 °C/s (max.)
Fig. 4 Solder Reflow Temperatures and Time Durations
Revision: 16-Mai-13
2
Document Number: 71622
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000