SI7540ADP Datasheet, PDF (1/18 Pages) Vishay Siliconix – N-and P-Channel 20 V (D-S) MOSFET

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Si7540ADP
Vishay Siliconix
N- and P-Channel 20 V (D-S) MOSFET
PowerPAK^® SO-8 Dual
D₁
D_{1 8}
D_{2 7}
D_{2 6}
5
6.15 _mm
1
Top View
5.15 ^mm
1
2 S₁
3 G₁
4 S₂
G₂
Bottom View
PRODUCT SUMMARY
N-CHANNEL P-CHANNEL
V_DS (V)
R_DS(on) () at V_GS = ± 4.5 V
R_DS(on) () at V_GS = ± 2.5 V
Q_g typ. (nC)
I_D (A) ^{a, b}
Configuration
20
-20
0.0150
0.0280
0.0195
0.0430
8.5
16
12
9
N- and p-pair
FEATURES
• TrenchFET^® power MOSFETs
• Thermally enhanced PowerPAK^®
• 100 % R_g tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• DC/DC converters
D₁
S₂
• Synchronous buck converter
• Synchronous rectifier
G₂
• Load switch
G₁
• Motor drive switch
S₁
D₂
N-Channel MOSFET
P-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK SO-8
Si7540ADP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
N-CHANNEL
10 s
STEADY
P-CHANNEL
10 s
STEADY
Drain-source voltage
Gate-source voltage
Continuous drain current (T_J = 150 °C) ^{a, b}
Pulsed drain current
T_A = 25 °C
T_A = 70 °C
Continuous source current (diode conduction) ^b
Maximum power dissipation ^b
T_A = 25 °C
T_A = 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) ^{d, e}
V_DS
V_GS
I_D
I_DM
I_S
P_D
T_J, T_stg
20
-20
± 12
12
8
-9
-6.1
9.8
6.5
-7.3
-4.9
35
-25
2.9
1.3
-2.9
-1.3
3.5
1.6
3.5
1.6
2.3
1
2.3
1
-55 to +150
260
UNIT
V
A
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
N-CHANNEL
TYP. MAX.
P-CHANNEL
TYP. MAX.
UNIT
Maximum junction-to-ambient ^{b, f}
Maximum junction-to-case (drain)
t 10 s
Steady state
R_thJA
R_thJC
25
35
25
35
4.6
6
4.8
6.3
°C/W
Notes
a. Based on silicon capability only.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
S16-2274-Rev. C, 14-Nov-16
1
Document Number: 62951
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000