MMU0102 Datasheet, PDF (11/13 Pages) Vishay Siliconix – Professional MELF Resistors

MMU 0102, MMA 0204, MMB 0207 - Professional
Vishay Beyschlag
Professional MELF Resistors
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2*
TEST
METHOD
TEST
PROCEDURE
STABILITY CLASS
0.25
OR BETTER
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
STABILITY
CLASS 0.5
OR BETTER
STABILITY CLASS
1
OR BETTER
STABILITY
CLASS 2
OR BETTER
stability for product
types:
MMU 0102 10 Ω to 221kΩ
1Ω to < 10 Ω
<1Ω
MMA 0204 10 Ω to 332 kΩ
1Ω to < 10 Ω
<1Ω
MMB 0207 10 Ω to 1 MΩ
1Ω to < 10 Ω
<1Ω
4.37
-
periodic elec- U = _{15 × P70 × R}
tric overload; ≤ 2 x U_max;
standard oper- 0.1 s on; 2.5 s off;
ation mode
1000 cycles
± (0.5 % R + 5 mΩ)
periodic elec-
tric overload;
power opera-
± (1 % R + 5 mΩ)
> 221 kΩ
> 332 kΩ
> 1 MΩ
4.22
6 (Fc) vibration
endurance by
sweeping; 10 to
2000 Hz; no
resonance;
amplitude
≤ 1.5 mm or
≤ 200 m/s²; 6 h
± (0.05 % R + 5 mΩ)
± (0.1 % R + 5 mΩ)
4.40
-
electrostatic IEC 61340-3-1*;
discharge
3 pos. + 3 neg.
(Human
discharges
Body Model) MMU 0102: 1.5 kV
MMA 0204: 2 kV
MMB 0207: 4 kV
± (0.5 % R + 50 mΩ)
4.17.2
58 (Td) solderability
solder bath method;
SnPb40;
non-activated flux;
(215 ± 3) °C;
(3 ± 0.3) s
solder bath method;
SnAg3Cu0,5 or
SnAg3,5;
non-activated flux;
(235 ± 3) °C;
(2 ± 0.2) s
good tinning (≥ 95 % covered); no visible damage
good tinning (≥ 95 % covered); no visible damage
4.18.2
4.29
4.30
58 (Td)
45 (XA)
45 (XA)
resistance to
soldering heat
component
solvent
solvent
resistance of
marking
solder bath method; ± (0.05 % R + 10 mΩ) ± (0.1 % R + 10 mΩ) ± (0.25 % R + 10 mΩ) ± (0.25 % R + 10 mΩ)
(260 ± 5) °C;
(10 ±1) s
reflow method 2
(IR/forced gas
convection);
(260 ± 5) °C;
(10 ±1) s
± (0.02 % R + 10 mΩ) ± (0.05 % R + 10 mΩ) ± (0.05 % R + 10 mΩ) ± (0.1 % R + 10 mΩ)
isopropyl alcohol;
50 °C; method 2
no visible damage
isopropyl alcohol;
50 °C; method 1,
toothbrush
marking legible;
no visible damage
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Document Number: 28713
Revision: 18-Jul-06