PR02000201008JA100 Datasheet, PDF (10/16 Pages) Vishay Siliconix – Power Metal Film Leaded Resistors

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APPLICATION INFORMATION
100
∆T
(K)
80
60
40
20
15 mm
20 mm
25 mm
0
0
0.4
Ø 0.6 mm FeCu-leads
0.8 _{P (W)} 1.2
Minimum distance from resistor body to PCB = 1 mm
PR01 Temperature rise (T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
100
∆T
(K)
80
15 mm
60
20 mm
40
25 mm
20
0
0
1
P (W)
2
Ø 0.8 mm Cu-leads
Minimum distance from resistor body to PCB = 1 mm
PR02 Temperature rise (T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
100
∆T
(K)
80
60
15 mm
40
20 mm
25 mm
20
0
0
1
P (W)
2
Ø 0.6 mm FeCu-leads
Minimum distance from resistor body to PCB = 1 mm
PR02 Temperature rise (T) at the lead end (soldering point) as a
function of dissipated power at various lead lengths after mounting.
PR01/02/03
Vishay BCcomponents
200
∆T
(K)
160
120
80
40
0
0
0.8
Ø 0.8 mm Cu-leads
1.6 _{P (W)} 2.4
PR02 Hot-spot temperature rise (T) as a function
of dissipated power.
240
ΔT
(K)
200
160
120
80
40
0
0
0.8
Ø 0.6 mm FeCu-leads
1.6 _{P (W)} 2.4
PR02 Hot-spot temperature rise (T) as a function
of dissipated power.
240
ΔT
(K)
200
160
120
80
40
0
0
Ø 0.8 mm FeCu-leads
1
P (W)
2
PR02 Hot-spot temperature rise (T) as a function
of dissipated power.
Revision: 24-Jun-13
10
Document Number: 28729
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