15536 Datasheet, PDF (10/13 Pages) Vishay Siliconix – Solid Tantalum Chip Capacitors

595D
Solid Tantalum Chip Capacitors
TANTAMOUNT® Conformal Coated,
Vishay Sprague
Maximum CV
GUIDE TO APPLICATION (Continued)
3.1 The sum of the peak AC voltage plus the applied DC
as high as practical. The flux (in the paste) must be
voltage shall not exceed the DC voltage rating of the
active enough to remove the oxides formed on the
capacitor.
metallization prior to the exposure to soldering heat.
3.2 The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at + 25 °C.
4. Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating at + 25 °C and 5 % of
the DC rating at + 85 °C.
5. Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
Temperature
Derating Factor
+ 25 °C
1.0
+ 85 °C
0.9
+ 125 °C
0.4
6. Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent Irms value be
established when calculating permissible operating
levels. (Power dissipation calculated using + 25 °C
temperature rise.)
Case Code
T
S
A
B
M
C
D
G
H
R
Maximum Permissible Power
Dissipation at
+ 25 °C (watts) in Free Air
0.030
0.060
0.075
0.085
0.095
0.110
0.150
0.115
0.125
0.250
7. Printed Circuit Board Materials: The capacitors are
compatible with most commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel). If your
desired board material is not shown there please
contact the Tantalum Marketing Department for
assistance in determining compatibility.
8. Attachment:
8.2 Soldering: Capacitors can be attached by
conventional soldering techniques, vapor phase
convection, infrared reflow, wave soldering and hot
plate methods. The Soldering Profile charts show
typical recomended time/temperature conditions for
soldering. Preheating is recommended to reduce
thermal stress. The recommended maximum preheat
rate is 2 °C per second. Attachment with a soldering
iron is not recommended due to the difficulty of
controlling temperature and time at temperature. The
soldering iron must never come in contact with the
capacitor.
RECOMMENDED REFLOW SOLDERING PROFILE
Recommended Pb Free Reflow Soldering Profile
245 °C
10 sec
200 °C
217 °C
60 sec
150 °C
60 - 150 sec
Preheat
25 °C
TIME (SECONDS)
Large Case Codes: D, R
Recommended Pb Free Reflow Soldering Profile
260 °C
200 °C
217 °C
150 °C
60 - 150 sec
Preheat
10 sec
60 sec
25 °C
TIME (SECONDS)
Large Case Codes: B, C
Recommended SnPb Reflow Soldering Profile
225 °C
183 °C
150 °C
10 sec
100 °C
60 - 90 sec
Preheat
60 sec
8.1 Solder Paste: The recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
25 °C
TIME (SECONDS)
All Case Codes
Document Number: 40007
Revision: 16-Dec-05
For technical questions, contact: [e-mail]
www.vishay.com
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