SIJH440E Datasheet, PDF (1/7 Pages) Vishay Siliconix – N-Channel 40 V (D-S) 175 °C MOSFET

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SiJH440E
Vishay Siliconix
N-Channel 40 V (D-S) 175 °C MOSFET
PowerPAK^® 8 x 8L Single
1
8.1 ^mm
Top View
PRODUCT SUMMARY
V_DS (V)
R_DS(on) max. () at V_GS = 10 V
R_DS(on) max. () at V_GS = 4.5 V
Q_g typ. (nC)
I_D (A) ^{a, g}
Configuration
D
1
2^G
3^S
4^S
S
Bottom View
40
0.00096
0.00115
127
200
Single
FEATURES
• TrenchFET^® Gen IV power MOSFET
• Fully lead (Pb)-free device
• Optimized Q_g, Q_gd, and Q_gd/Q_gs ratio reduces
switching related power loss
• Up to 200 A maximum continuous drain current
• 50 % smaller footprint than D²PAK / TO-263
• 100 % R_g and UIS tested
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
D
• Synchronous rectification
• OR-ing
• Motor drive control
G
• Battery management
N-Channel MOSFET
S
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK 8 x 8L
SiJH440E-T1-GE3
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-source voltage
Gate-source voltage
Continuous drain current (T_J = 150 °C)
Pulsed drain current (t = 100 μs)
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
T_C = 25 °C
T_A = 25 °C
L = 0.1 mH
T_C = 25 °C
Maximum power dissipation
T_C = 70 °C
T_A = 25 °C
T_A =70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) ^c
V_DS
V_GS
I_D
I_DM
I_S
I_AS
E_AS
P_D
T_J, T_stg
LIMIT
40
+20 / -16
200 ^a
200 ^a
40 ^b
33.8 ^b
500
160
2.67 ^{b, c}
60
180
158
110
3^b
2.1 ^b
-55 to +175
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum junction-to-ambient ^b
Steady state
R_thJA
42
Maximum junction-to-case (drain)
Steady state
R_thJC
0.8
50
°C/W
0.95
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 8 x 8L is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 50 °C/W.
g. T_C = 25 °C.
S16-2149-Rev. A, 17-Oct-16
1
Document Number: 76206
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000