SIAA40DJ Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 40 V (D-S) MOSFET

www.vishay.com
SiAA40DJ
Vishay Siliconix
N-Channel 40 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
40
R_DS(on) () MAX.
0.0125 at V_GS = 10 V
0.0160 at V_GS = 4.5 V
I_D (A) ^a
30
26.6
Q_g (TYP.)
7.7
PowerPAK^® SC-70-6L Single
D
D6
S5
4
1 _2.05 ^mm
Top View
S
7
1
2D
3D
G
Bottom View
Marking Code: A L
Ordering Information:
SiAA40DJ-T1-GE3 (lead (Pb)-free and halogen-free)
FEATURES
• TrenchFET^® Gen IV power MOSFET
• Tuned for the lowest R_DS - Q_oss FOM
• Thermally enhanced PowerPAK^® SC-70 package
- Small footprint area
• 100 % R_g and UIS tested
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
D
• DC/DC converters
• Synchronous rectification
• Motor drive control
• Battery management and
G
protection
• Load switch
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 100 μs)
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Continuous Source-Drain Diode Current
Single-Pulse Avalanche Current
Single-Pulse Avalanche Energy
T_C = 25 °C
T_A = 25 °C
L = 0.1 mH
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) ^{d, e}
V_DS
V_GS
I_D
I_DM
I_S
I_AS
E_AS
P_D
T_J, T_stg
LIMIT
40
+20 / -16
30
24
12.8 ^{b, c}
10.2 ^{b, c}
60
16
2.9 ^{b, c}
10
5
19.2
12.3
3.5 ^{b, c}
2.2 ^{b, c}
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t5s
Steady state
SYMBOL
R_thJA
R_thJC
TYPICAL
28
5.3
MAXIMUM
36
6.5
UNIT
°C/W
Notes
a. T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
S16-1460-Rev. B, 25-Jul-16
1
Document Number: 75671
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000