SIA906EDJ Datasheet, PDF (1/9 Pages) Vishay Siliconix – Dual N-Channel 20-V (D-S) MOSFET

New Product
Dual N-Channel 20-V (D-S) MOSFET
SiA906EDJ
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.046 at V_GS = 4.5 V
20
0.063 at V_GS = 2.5 V
I_D (A)^a
4.5
4.5
Q_g (Typ.)
3.5 nC
FEATURES
• Halogen-free According to IEC 61249-2-21
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
SC-70 Package
- Small Footprint Area
- Low On-Resistance
• Typical ESD Protection 560 V
APPLICATIONS
PowerPAK SC-70-6 Dual
• Load Switch for Portable Applications
• High Frequency DC/DC Converter
1
D₁
D₂
S₁
2
G1
D1
3
D2
D₁
6
D2
Marking Code
G₁
G₂
G2
CCX
5
2.05 mm S₂
2.05 mm
Part # code
XXX
4
Lot Traceability
and Date code
Ordering Information: SiA906EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
S₁
N-Channel MOSFET
S₂
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
20
V
V_GS
± 12
T_C = 25 °C
4.5^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
4.5^a
4.5^{a, b, c}
T_A = 70 °C
4.1^{b, c}
A
Pulsed Drain Current
I_DM
15
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
4.5^a
1.6^{b, c}
T_C = 25 °C
7.8
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
5
1.9^{b, c}
W
T_A = 70 °C
1.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
Steady State
R_thJA
R_thJC
52
12.5
65
°C/W
16
Notes:
a. Package limited
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 110 °C/W.
Document Number: 69067
S-83087-Rev. A, 29-Dec-08
www.vishay.com
1