SIA513DJ Datasheet, PDF (1/14 Pages) Vishay Siliconix – N- and P-Channel 20-V (D-S) MOSFET

New Product
SiA513DJ
Vishay Siliconix
N- and P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.060 at V_GS = 4.5 V
N-Channel 20
0.092 at V_GS = 2.5 V
P-Channel
0.110 at V_GS = - 4.5 V
- 20
0.185 at V_GS = - 2.5 V
I_D (A)
4.5^a
4.5^a
- 4.5^a
- 4.5^a
Q_g (Typ.)
3.5 nC
3 nC
FEATURES
• Halogen-free
• TrenchFET^® Power MOSFETs
• New Thermally Enhanced PowerPAK^®
SC-70 Package
- Small Footprint Area
- Low On-Resistance
RoHS
COMPLIANT
PowerPAK SC-70-6 Dual
APPLICATIONS
• Portable Devices
1
S1
2
G₁
D1
3
D2
Marking Code
D₁
S₂
D1
6
D2
EBX
G₂
G2
5
2.05 mm S₂
2.05 mm
Part # code
XXX
G₁
Lot Traceability
4
and Date code
Ordering Information: SiA513DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
S₁
D₂
N-Channel MOSFET P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
N-Channel
P-Channel
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
20
- 20
V_GS
± 12
V
T_C = 25 °C
4.5^a
- 4.5^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
4.5^a
4.5^{a, b, c}
- 4.5^a
- 3.3^{b, c}
T_A = 70 °C
3.2^{b, c}
- 2.4^{b, c}
A
Pulsed Drain Current
I_DM
15
- 10
Source Drain Current Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
4.5^a
1.6^{b, c}
- 4.5^a
- 1.6^{b, c}
T_C = 25 °C
6.5
6.5
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
5
1.9^{b, c}
5
1.9^{b, c}
W
T_A = 70 °C
1.2^{b, c}
1.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
N-Channel
P-Channel
Parameter
Symbol
Typ. Max. Typ. Max.
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
Steady State
R_thJA
R_thJC
52
65
52
65
12.5
16
12.5
16
°C/W
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 110 °C/W.
Document Number: 70443
S-80437-Rev. B, 03-Mar-08
www.vishay.com
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