SIA469DJ Datasheet, PDF (1/7 Pages) Vishay Siliconix – P-Channel 30 V (D-S) MOSFET

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SiA469DJ
Vishay Siliconix
P-Channel 30 V (D-S) MOSFET
PowerPAK^® SC-70-6L Single
D
D6
S5
4
1 _2.05 ^mm
Top View
PRODUCT SUMMARY
V_DS (V)
R_DS(on) max. () at V_GS = -10 V
R_DS(on) max. () at V_GS = -4.5 V
Q_g typ. (nC)
I_D (A) ^a
Configuration
S
7
1
2D
3D
G
Bottom View
-30
0.0265
0.0400
10
-12
Single
FEATURES
• TrenchFET^® Gen III p-channel power MOSFET
• Thermally enhanced PowerPAK^® SC-70 package
• 100% R_g tested
• Material categorization: 
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Load switch
• DC/DC converters
• High speed switching
• Power management in
battery-operated, mobile and
wearable devices
S
G
P-Channel MOSFET
D
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK SC-70
SiA469DJ-T1-GE3
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-source voltage
Gate-source voltage
Continuous drain current (T_J = 150 °C)
Pulsed drain current (t = 100 μs)
T_C = 25 °C
T_C = 70 °C
T_A =25 °C
T_A = 70 °C
Continuous source-drain diode current
T_C = 25 °C
T_A = 70 °C
T_C = 25 °C
Maximum power dissipation
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) ^{d, e}
V_DS
V_GS
I_D
I_DM
I_S
P_D
T_J, T_stg
LIMIT
-30
± 20
-12 ^a
-12 ^a
-8.8 ^{b, c}
-7 ^{b, c}
-40
-12 ^a
-2.7 ^{b, c}
15.6
10
3.3 ^{b, c}
2.1 ^{b, c}
-55 to +150
260
UNIT
V
A
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum junction-to-ambient ^{b, f}
t5s
R_thJA
30
Maximum junction-to-case (drain)
Steady state
R_thJC
6.5
38
°C/W
8
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
S16-2441Rev. A, 05-Dec-16
1
Document Number: 75354
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000