SIA446DJ Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 150 V (D-S) MOSFET

www.vishay.com
SiA446DJ
Vishay Siliconix
N-Channel 150 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
150
R_DS(on) () MAX.
0.177 at V_GS = 10 V
0.185 at V_GS = 7.5 V
0.250 at V_GS = 6 V
I_D (A) ^a
7.7
7.6
4
PowerPAK^® SC-70-6L Single
D
D6
S5
4
Q_g (TYP.)
4.3 nC
S
1 _2.05 ^mm
Top View
Marking Code: AV
1
2D
3D
G
Bottom View
Ordering Information:
SiA446DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• ThunderFET^® technology optimizes balance
of R_DS(on), Q_g, Q_sw and Q_oss
• 100 % R_g and UIS tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
D
• DC/DC converters / boost converters
• Synchronous rectification
• Power management
• LED backlighting
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
T_C = 25 °C
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
Pulsed Drain Current (t = 100 μs)
I_DM
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
E_AS
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
T_A = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{d, e}
T_J, T_stg
LIMIT
150
± 20
7.7
6.2
3.3 ^{b, c}
2.6 ^{b, c}
10
12
2.9 ^{b, c}
7
2.5
19
12
3.5 ^{b, c}
2.2 ^{b, c}
-55 to 150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t5s
R_thJA
28
Steady State
R_thJC
5.3
36
°C/W
6.5
Notes
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
S14-0208-Rev. B, 10-Feb-14
1
Document Number: 62925
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000