SIA425EDJ Datasheet, PDF (1/7 Pages) Vishay Siliconix – P-Channel 20-V (D-S) MOSFET

P-Channel 20-V (D-S) MOSFET
SiA425EDJ
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.060 at V_GS = - 4.5 V
0.065 at V_GS = - 3.6 V
- 20
0.080 at V_GS = - 2.5 V
0.120 at V_GS = - 1.8 V
I_D (A)
- 4.5^a
- 4.5^a
- 4.5^a
-2
Q_g (Typ.)
4.9 nC
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
SC-70 Package
- Small Footprint Area
- Low On-Resistance
• Typical ESD Protection 2400 V
• 100 % R_g Tested
• Compliant to RoHS Directive 2002/95/EC
PowerPAK SC-70-6L-Single
APPLICATIONS
• Load Switch and Battery Switch
S
for Portable Devices
1
D
2
Marking Code
D
3
D
G
Part # code
BMX
G
6
XXX
D
S
5
Lot Traceability
and Date code
2.05 mm ^S
4
2.05 mm
Ordering Information: SiA425EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
R
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 20
V
V_GS
± 12
T_C = 25 °C
- 4.5^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
- 4.5^a
- 4.5^{a, b, c}
T_A = 70 °C
- 4.5^{a, b, c}
A
Pulsed Drain Current
I_DM
- 15
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
- 4.5^a
- 2.4^{b, c}
T_C = 25 °C
15.6
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
10
2.9^{b, c}
W
T_A = 70 °C
1.8^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
R_thJA
32
Steady State
R_thJC
6
43
°C/W
8
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 80 °C/W.
Document Number: 65575
S09-2268-Rev. A, 02-Nov-09
www.vishay.com
1