English
Language : 

SI8467DB Datasheet, PDF (1/8 Pages) Vishay Siliconix – P-Channel 20 V (D-S) MOSFET
P-Channel 20 V (D-S) MOSFET
Si8467DB
Vishay Siliconix
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω)
- 20
0.073 at VGS = - 4.5 V
0.125 at VGS = - 2.5 V
ID (A)a, e
- 3.4
- 2.6
Qg (Typ.)
6.9 nC
MICRO FOOT
Bump Side View
Backside View
S
G
2
1
S
D
3
4
Device Marking: 8467
xxx = Date/Lot Traceability Code
Ordering Information: Si8467DB-T2-E1 (Lead (Pb)-free and Halogen-free)
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• Ultra-Small 1 mm x 1 mm Maximum Outline
• Ultra-Thin 0.548 mm Maximum Height
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Load Switches, Battery Switches and Charger Switches
in Portable Device Applications
• DC/DC Converters
S
G
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Package Reflow Conditionsc
TA = 25 °C
TA = 70 °C
TA = 25 °C
TA = 70 °C
TC = 25 °C
TA = 25 °C
TA = 25 °C
TA = 70 °C
TA = 25 °C
TA = 70 °C
VPR
IR/Convection
VDS
VGS
ID
IDM
IS
PD
TJ, Tstg
- 20
± 12
- 3.7a
- 2.7a
- 2.5b
- 2.0b
- 15
- 1.5a
- 0.65b
1.8a
1.1a
0.78b
0.5b
- 55 to 150
260
260
Notes:
a. Surface mounted on 1" x 1" FR4 board with full copper, t = 10 s.
b. Surface mounted on 1" x 1" FR4 board with minimum copper, t = 10 s.
c. Refer to IPC/JEDEC (J-STD-020C), no manual or hand soldering.
d. In this document, any reference to case represents the body of the MICRO FOOT device and foot is the bump.
e. Based on TA = 25 °C.
Document Number: 65930
S10-0643-Rev. A, 22-Mar-10
Unit
V
A
W
°C
www.vishay.com
1