SI7463ADP Datasheet, PDF (1/13 Pages) Vishay Siliconix – P-Channel 40 V (D-S) MOSFET

New Product
P-Channel 40 V (D-S) MOSFET
Si7463ADP
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
I_D (A)
0.0100 at V_GS = - 10 V
- 46
- 40
0.0135 at V_GS = - 4.5 V
- 40
PowerPAK SO-8
Q_g (Typ.)
48.6 nC
6.15 mm
S
1
S
5.15 mm
2
S
3
G
4
D
8
D
7
D
6
D
5
Bottom View
Ordering Information:
Si7463ADP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• 100% R_g and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Load Switch
• Motor Drives
S
G
P-Channel MOSFET
D
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 40
V
V_GS
± 20
T_C = 25 °C
- 46
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 300 µs)
Continuous Source-Drain Diode Current
Avalanche Current
Single-Pulse Avalanche Energy
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
I_DM
T_C = 25 °C
T_A = 25 °C
I_S
L = 0.1 mH
I_AS
E_AS
- 37
- 16.6^{a, b}
- 13.3^{a, b}
A
- 70
- 35^d
- 4.3^{a, b}
- 30
45
mJ
T_C = 25 °C
39
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
25
5^{a, b}
W
T_A = 70 °C
3.2^{a, b}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{e, f}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{a, c}
Maximum Junction-to-Case
t 10 s
Steady State
Symbol
R_thJA
R_thJC
Typical
20
2.1
Maximum
25
3.2
Unit
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. Maximum under steady state conditions is 70 °C/W.
d. Package limited.
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 63354
www.vishay.com
S11-1661-Rev. A, 15-Aug-11
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000