SI7431DP-T1-GE3 Datasheet, PDF (1/8 Pages) Vishay Siliconix – P-Channel 200 V (D-S) MOSFET

P-Channel 200 V (D-S) MOSFET
Si7431DP
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
- 200
R_DS(on) ()
0.174 at V_GS = - 10 V
0.180 at V_GS = - 6 V
I_D (A)
- 3.8
- 3.6
Q_g (Typ.)
88
PowerPAK SO-8
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFETs
• Ultra-Low On-Resistance Critical for
Application
• Low Thermal Resistance PowerPAK^®
Package with Low 1.07 mm Profile
• 100 % R_g and Avalanche Tested
• Compliant to RoHS Directive 2002/95/EC
6.15 mm
D
8
D
7
D
6
D
5
S
1
S
5.15 mm
2
S
3
G
4
Bottom View
Ordering Information: Si7431DP-T1-E3 (Lead (Pb)-free)
Si7431DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
APPLICATIONS
• Active Clamp in Intermediate
DC/DC Power Supplies
S
G
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
10 s
Steady State
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 200
V
V_GS
± 20
Continuous Drain Current (T_J = 150°C)^a
T_A = 25 °C
T_A = 70 °C
I_D
- 3.8
- 3.0
- 2.2
- 1.8
Pulsed Drain Current
Continuous Source Current (Diode Conduction)^a
I_DM
- 30
A
I_S
- 4.2
- 1.6
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
- 30
E_AS
45
mJ
Maximum Power Dissipation^a
T_A = 25 °C
T_A = 70 °C
P_D
5.4
1.9
3.4
1.2
W
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{b, c}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^a
t  10 s
18
Steady State
R_thJA
50
23
65
°C/W
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
1.0
1.5
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 73116
S10-2246-Rev. E, 04-Oct-10
www.vishay.com
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