SI7160DP Datasheet, PDF (1/7 Pages) Vishay Siliconix – N-Channel 30-V (D-S) MOSFET with Schottky Diode

Si7160DP
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET with Schottky Diode
PRODUCT SUMMARY
V_DS (V)
30
R_DS(on) (Ω)
0.0087 at V_GS = 10 V
0.010 at V_GS = 4.5 V
PowerPAK SO-8
I_D (A)^a
20
20
Q_g (Typ.)
21
6.15 mm
S
1
S
5.15 mm
2
S
3
G
4
D
8
D
7
D
6
D
5
Bottom View
Ordering Information: Si7160DP-T1-E3 (Lead (Pb)-free)
Si7160DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• Halogen-free According to IEC 61249-2-21
Available
• Ultra-Low On-Resistance Using High
Density TrenchFET^® Gen II Power
MOSFET Technology
• Q_g Optimized
• New Low Thermal Resistance PowerPAK^®
Package with Low 1.07 mm Profile
• 100 % R_g Tested
D
• 100 % UIS Tested
APPLICATIONS
• Notebook
- Logic DC/DC
G
Schottky Diode
N-Channel MOSFET
S
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V_GS
± 16
V
T_C = 25 °C
20^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
20^a
17.8^{b, c}
Pulsed Drain Current
T_A = 70 °C
I_DM
14.2^{b, c}
60
A
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
20^a
4.5^{b, c}
Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
E_AS
20
20
mJ
T_C = 25 °C
27.7
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
17.7
5^{b, c}
W
T_A = 70 °C
3.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t ≤ 10 s
Steady State
Symbol
R_thJA
R_thJC
Typical
20
3.4
Maximum
25
4.5
Unit
°C/W
Notes:
a. Package Limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (www.vishay.com/doc?73461). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 70 °C/W.
Document Number: 74954
S09-0273-Rev. B, 16-Feb-09
www.vishay.com
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