SI5936DU Datasheet, PDF (1/9 Pages) Vishay Telefunken – Dual N-Channel 30-V (D-S) MOSFET

New Product
Dual N-Channel 30-V (D-S) MOSFET
Si5936DU
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
0.030 at V_GS = 10 V
30
0.040 at V_GS = 4.5 V
I_D (A)^a
6
6
Q_g (Typ.)
3.5 nC
PowerPAK ChipFET Dual
Marking Code
CF XXX
Lot Traceability
and Date Code
Part # Code
3.0 _mm
1.^{8 mm}
Bottom View
Ordering Information:
Si5936DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Power MOSFET
• Thermally Enhanced PowerPAK^®
ChipFET^® Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
• 100 % R_g Tested
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Network
• System Power DC/DC
D₁
D₂
G₁
G₂
S₁
N-Channel MOSFET
S₂
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V
V_GS
± 20
T_C = 25 °C
6^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
6^a
6^{a, b, c}
T_A = 70 °C
5.3^{b, c}
A
Pulsed Drain Current (t = 300 µs)
I_DM
25
T_C = 25 °C
Continuous Source-Drain Diode Current
T_A = 25 °C
I_S
6^a
1.9^{b, c}
T_C = 25 °C
10.4
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
6.7
2.3^{b, c}
W
T_A = 70 °C
1.5^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t5s
Steady State
Symbol
R_thJA
R_thJC
Typical
43
9.5
Maximum
55
12
Unit
°C/W
Notes:
a. Package limited
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 105 °C/W.
Document Number: 62804
For technical questions, contact: [e-mail]
www.vishay.com
S12-2729-Rev. A, 12-Nov-12
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000