SI5456DU Datasheet, PDF (1/10 Pages) Vishay Siliconix – N-Channel 20-V (D-S) MOSFET

N-Channel 20-V (D-S) MOSFET
Si5456DU
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
20
0.010 at V_GS = 10 V
0.0135 at V_GS = 4.5 V
PowerPAK ChipFET Single
1
2
D
3
D
D
4
8
D
7
D
6
S
D
G
S
5
Bottom View
FEATURES
I_D (A)^a
12
12
Q_g (Typ.)
9.8 nC
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Gen III Power MOSFET
• New Thermally Enhanced PowerPAK^®
ChipFET^® Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
• 100 % R_g Tested
• Compliant to RoHS Directive 2002/95/EC
D
APPLICATIONS
Marking Code
• Load Switch
• DC/DC
AC XXX
Lot Traceability
G
and Date Code
Part # Code
S
Ordering Information: Si5456DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
20
V
V_GS
± 20
T_C = 25 °C
12^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
12^a
12^{a, b, c}
T_A = 70 °C
10.8^{b, c}
A
Pulsed Drain Current
I_DM
50
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
12^a
2.6^{b, c}
T_C = 25 °C
31
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
20
3.1^{b, c}
W
T_A = 70 °C
2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
R_thJA
34
Steady State
R_thJC
3
40
°C/W
4
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 90 °C/W.
Document Number: 64800
S09-0665-Rev. A, 20-Apr-09
www.vishay.com
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