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SI5401DC Datasheet, PDF (1/5 Pages) Vishay Siliconix – P-Channel 20-V (D-S) MOSFET | |||
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New Product
Si5401DC
Vishay Siliconix
P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
rDS(on) (W)
0.032 @ VGS = â4.5 V
â20
0.040 @ VGS = â2.5 V
0.053 @ VGS = â1.8 V
ID (A)
â7.1
â6.4
â5.5
1206-8 ChipFETr
Qg (Typ)
16.5
FEATURES
D TrenchFETr Power MOSFET
D Ultra-Low On-Resistance
D Thermally Enhanced ChipFETr Package
D 40% Smaller Footprint Than TSOP-6
APPLICATIONS
D Load Switch, PA Switch, and Battery Switch
for Portable Devices
1
D
D
D
D
D
D
G
S
Bottom View
Ordering Information: Si5401DC-T1âE3
Marking Code
BO XXX
Lot Traceability
and Date Code
Part # Code
S
G
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs Steady State
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150_C)a
Pulsed Drain Current
Continuous Source Currenta
Maximum Power Dissipationa
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)b, c
TA = 25_C
TA = 85_C
TA = 25_C
TA = 85_C
VDS
VGS
ID
IDM
IS
PD
TJ, Tstg
â20
"8
â7.1
â5.2
â5.1
â3.7
â20
â2.1
â1.1
2.5
1.3
1.3
0.7
â55 to 150
260
Unit
V
A
W
_C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
t v 5 sec
40
Steady State
RthJA
80
Steady State
RthJF
15
50
95
_C/W
20
Notes
a. Surface Mounted on 1â x 1â FR4 Board.
b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation
process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder intercon-
nection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 73225
S-50038âRev. A, 17-Jan-05
www.vishay.com
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