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| V23990-K223-A-PM Datasheet, PDF (8/17 Pages) Vincotech – Solderless interconnection | |||
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V23990-K223-A-PM
T1,T2,T3,T4,T5,T6,T7 / D1,D2,D3,D4,D5,D6,D7
Figure 17
Typical rate of fall of forward
and reverse recovery current as a
function of collector current
dI0/dt,dIrec/dt = f(IC)
4000
dI0/dt
3200
dIrec/dt
2400
1600
800
di0/dtHigh T
D1,D2,D3,D4,D5,D6,D7 FWD
dIo/dtLow T
Figure 18
Typical rate of fall of forward
and reverse recovery current as a
function of IGBT turn on gate resistor
dI0/dt,dIrec/dt = f(Rgon)
8000
D1,D2,D3,D4,D5,D6,D7 FWD
dI0/dt
dIrec/dt
6000
dIrec/dtHigh T
dIrec/dtLow T
4000
2000
0
0
20
40
At
Tj =
VCE =
VGE =
Rgon =
25/125 °C
300
V
±15
V
8
â¦
Figure 19
IGBT transient thermal impedance
as a function of pulse width
ZthJH = f(tp)
101
60
80
I C (A) 100
0
0
8
16
24
32 R gon ( ⦠) 40
At
Tj =
VR =
IF =
VGE =
25/125 °C
300
V
50
A
±15
V
T1,T2,T3,T4,T5,T6,T7 IGBT
Figure 20
FWD transient thermal impedance
as a function of pulse width
ZthJH = f(tp)
101
D1,D2,D3,D4,D5,D6,D7 FWD
100
100
10-1
10-2
10-5
10-4
10-3
10-2
10-1
At
D=
RthJH =
tp / T
0,95
K/W
IGBT thermal model values
Thermal grease
R (C/W) Tau (s)
0,02
9,9E+00
0,13
9,6E-01
0,48
1,5E-01
0,20
3,4E-02
0,06
5,2E-03
0,05
3,5E-04
D = 0,5
0,2
0,1
0,05
0,02
0,01
0,005
0.000
100 t p (s)
10110
10-1
10-2
10-5
10-4
10-3
10-2
10-1
At
D=
RthJH =
tp / T
1,6
K/W
FWD thermal model values
Thermal grease
R (C/W) Tau (s)
0,04
9,2E+00
0,22
1,0E+00
0,66
2,1E-01
0,38
4,0E-02
0,19
7,0E-03
0,11
7,5E-04
D = 0,5
0,2
0,1
0,05
0,02
0,01
0,005
0.000
100
t p (s) 10110
Copyright by Vincotech
8
Revision: 3.1
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