V048K020T080 Datasheet, PDF (9/15 Pages) Vicor Corporation – VI Chip - VTM Voltage Transformation Module

CONFIGURATION OPTIONS
CONFIGURATION
Effective Current Density
Junction-Board
Thermal Resistance
Junction-Case
Thermal Resistance
Junction-Ambient
Thermal Resistance 300LFM
IN-BOARD*
(Fig. 14)
467 A/in³
2.1 °C/W
1.1 °C/W
6.5 °C/W
*Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
ON-BOARD*
(Fig. 15)
292 A/in³
2.4 °C/W
1.1 °C/W
6.8 °C/W
IN-BOARD WITH 0.25"
HEATSINK
182 A/in³
2.1 °C/W
N/A
5.0 °C/W
ON-BOARD WITH 0.25"
HEATSINK
146 A/in³
2.4 °C/W
N/A
5.0 °C/W
21.5
0.85
22.0
0.87
32.0
32.0
1.26
1.26
P R E L I M I N A RY 4.0
0.16
IN–BOARD MOUNT
(V•I Chip recessed into PCB)
Figure 14—In-board mounting – package K
6.3
0.25
mm
ON–BOARD MOUNT
mm
in
in
Figure 15—On-board mounting – package F
Vicor Corporation
Tel: [phone]
vicorpower.com
V•I Chip Voltage Transformation Module V048K020T080 Rev. 1.2
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