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V048K020T080 Datasheet, PDF (5/15 Pages) Vicor Corporation – VI Chip - VTM Voltage Transformation Module
Specifications, continued
THERMAL
Symbol Parameter
Min
Over temperature shutdown
125
Thermal capacity
RθJC
Junction-to-case thermal impedance
RθJB
Junction-to-BGA thermal impedance
RθJA
Junction-to-ambient 1
RθJA
Junction-to-ambient 2
Typ
Max
Unit
130
135
°C
0.61
Ws/°C
1.1
°C/W
2.1
°C/W
6.5
°C/W
5.0
°C/W
Notes
1. V048K020T080 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
2. V048K020T080 with a 0.25"H heatsink surface mounted on FR4 board, 300 LFM.
Note
Junction temperature
P R E L I M I N A RY V•I CHIP STRESS DRIVEN PRODUCT QUALIFICATION PROCESS
Test
High Temperature Operational Life (HTOL)
Temperature cycling
High temperature storage
Moisture resistance
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
Mechanical shock
Electro static discharge testing – human body model
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
Environment
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
150°C, 1,000 hrs
Moisture sensitivity Level 5
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Electro static discharge testing – machine model
EIA/JESD22-A115-A
Meets or exceeds 200 Volts
Highly Accelerated Life Testing (HALT)
Per Vicor Internal
Test Specification*
Operation limits verified, destruct margin determined
Dynamic cycling
Per Vicor internal
test specification*
Constant line, 0-100% load, -20°C to 125°C
* For details of the test protocols see Vicor’s website.
V•I CHIP BALL GRID ARRAY INTERCONNECT QUALIFICATION
Test
BGA solder fatigue evaluation
Solder ball shear test
Standard
IPC-9701
IPC-SM-785
IPC-9701
Environment
Cycle condition: TC3 (-40 to +125°C)
Test duration: NTC-B (500 failure free cycles)
Failure through bulk solder or copper pad lift-off
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Voltage Transformation Module V048K020T080 Rev. 1.2
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