LCAS6-10-L Datasheet, PDF (1/4 Pages) Vicor Corporation – VI CHIP Evaluation Board

V^•I
C TM
HIP
Evaluation Board
• Oscilloscope probe jack
for output voltage and
ripple measurements
• Simple to use
• Ring lug or solder connections
• Parallelable
• This board suitable for the
following V•I Chip products:
Bus Converter Module (BCM)
Voltage Transformation
Module (VTM)
The V•I Chip evaluation board offers a convenient means to
2. + OUT, -OUT
evaluate the performance of Vicor’s Bus Converter Modules
An electronic or passive load should be connected to this
(BCM) or Voltage Transformation Modules (VTM).
location with short heavy gauge leads. Most commercially
The board has been optimized for user convenience.
available electronic loads do not have current slew rates
capable of exercising the V•I Chips capability. The evaluation
Refer to the appropriate V•I Chip datasheet for performance
board can be connected directly to the application for which
and operating limits. The datasheets are available for
the V•I Chip is intended; however, the interconnect
downloading at vicorpower.com.
impedances between the evaluation board and the application
P ^{R E L I M I N A RY It is important to remember that given the fast response of most}
V•I Chips, they can readily show the limitations of the source,
load, and associated wiring connected to the evaluation board.
Care should be exercised to minimize stray source and load
impedances in order to fully exercise the V•I Chip.
Please refer to Figure 1 for locations of the input and output
connections as viewed from the component side. Wires may be
soldered directly to the pads in lieu of ring lugs if desired to
minimize circuit impedances.
The evaluation board should be set up as follows:
Note: Care should be taken to avoid reversing polarities
can greatly effect the transient response. For applications
where transient response is critical, the user should consider
mounting the V•I Chip directly to the target application PCB.
3. OUTPUT VOLTAGE MEASUREMENT JACK (J1)
This connector is provided to make an accurate
measurements of the output voltage of the V•I Chip. Many
types of scope probes may be directly connected to this
point if the probe is equipped with a removable plastic
sheath. Be careful to avoid creating ground loops when
making measurements of the output or input voltage. It is
recommended that the measurements be made separately.
4. PARALLELING
if connecting to the opposite (solder) side of the board.
The paralleling and current sharing capability of the devices
can be demonstrated by stacking multiple evaluation PCBs
1. + IN, - IN
and interconnecting the inputs and outputs with standoffs
Connect a high quality, low noise power supply to this
of sufficient current handling capability to create a
location. The interconnect leads should be heavy gauge
3-dimensional array. See Figure 3.
and as short as possible. Additional capacitance may
have to be added on the evaluation board to make up
5. INPUT CURRENT MEASUREMENT
for impedances in the interconnect leads as well as
A current probe can be passed around the +IN lead connected
deficiencies in the source. It is important to remember
to the V•I Chip. Input capacitors on the evaluation board
that noise from the source, as well as any input source
are downstream of this measurement point.
voltage drops, will appear at the output of the V•I Chip
multiplied by its k factor.
45
Vicor Corporation Tel: [phone] vicorpower.com V•I Chip Evaluation Board
Rev. 1.2
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