FX-400-EAE-K Datasheet, PDF (4/9 Pages) Vectron International, Inc – Low Jitter Frequency Translator

Parameter
PreHeat Time
Ramp Up
Time Above 217 0C
Time To Peak Temperature
Time At 260 0C
Ramp Down
Reflow Profile
Table 5. Reflow Profile (IPC/JEDEC J-STD-020C)
Symbol
t
S
R
UP
t
L
t_AMB-P
t
P
R
DN
The FX-400 is qualified to meet the JEDEC stan-
dard for Pb-Free assembly. The temperatures
and time intervals listed are based on the Pb-Free
small body requirements. The temperatures refer
to the topside of the package, measured on the
package body surface. The FX-400 should not
be subjected to a wash process that will immerse
it in solvents. NO CLEAN is the recommended
procedure. The FX-400 has been designed for pick
and place reflow soldering. The FX-400 may be
reflowed once and should not be reflowed in the
inverted position.
Value
60 sec Min, 180 sec Max
3 0C/sec Max
60 sec Min, 150 sec Max
480 sec Max
20 sec Min, 40 sec Max
6 0C/sec Max
Tape Dimensions (mm)
W
F
Do
Po
44
20.2
1.5
4
Figure 4. Suggested IR Profile
Tape and Reel
Table 6. Tape and Reel Information
Reel Dimensions (mm)
P1
A
B
C
D
N
W1
W2
20
330
1.5
13
20.2
100
44.4
50.4
#/Reel
200
Figure 5. Tape and Reel
Page 4 of 9
Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com
Rev: 01Apr2009