UM5062_16 Datasheet, PDF (4/6 Pages) Union Semiconductor, Inc. – Dual Line ESD Protection Diode Array

UM5062
Applications Information
Device Connection Options
UM5062 ESD protection diode is designed to protect one or two I/O lines. The device is
unidirectional and may be used on lines where the signal polarity is above ground. The cathode band
should be placed towards the line that is to be protected.
Circuit Board Layout Recommendations for Suppression of ESD
Good circuit board layout is critical for the suppression of ESD induced transients. The following
guidelines are recommended:
1. Place the TVS near the input terminals or connectors to restrict transient coupling.
2. Minimize the path length between the TVS and the protected line.
3. Minimize all conductive loops including power and ground loops.
4. The ESD transient return path to ground should be kept as short as possible.
5. Never run critical signals near board edges.
6. Use ground planes whenever possible. For multilayer printed-circuit boards, use ground vias.
7. Keep parallel signal paths to a minimum.
8. Avoid running protection conductors in parallel with unprotected conductor.
9. Minimize all printed-circuit board conductive loops including power and ground loops.
10. Avoid using shared transient return paths to a common ground point.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin
finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small
compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile
will be determined by the requirements of the solder paste. Therefore, these devices are compatible
with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions,
matte tin does not have any added alloys that can cause degradation of the solder joint.
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