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CHA5356-QGG_15 Datasheet, PDF (10/16 Pages) United Monolithic Semiconductors – 17.7-23.6GHz Packaged HPA
CHA5356-QGG
Package outline (1)
17.7-23.6GHz Packaged HPA
Matte tin, Lead Free
Units :
From the standard :
29-
(Green)
mm
JEDEC MO-220
(VGGD)
GND
1- Gnd(2)
2- Gnd(2)
3- Gnd(2)
4- Gnd(2)
5- RF in
6- Gnd(2)
7- Gnd(2)
8- Gnd(2)
9- Vg1
10- Vg2
11- Vg3
12- Vd3
13- Nc
14- Gnd(2)
15- Gnd(2)
16- Gnd(2)
17- RF out
18- Gnd(2)
19- Gnd(2)
20- VREF
21- Gnd(2)
22- VDC
23- VDET
24- Vd3
25- Vg3
26- Vd2
27- Nc
28- Vd1
(1) The package outline drawing included in this data-sheet is given for indication. Refer to the
application note AN0017 (http://www.ums-gaas.com) for exact package dimensions.
(2) It is strongly recommended to ground all pins marked “Gnd” through the PCB board.
Ensure that the PCB board is designed to provide the best possible ground to the package.
Ref. : DSCHA5356-QGG4273- 30 Sep 14
10/16
Specifications subject to change without notice
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