BCN Datasheet, PDF (7/9 Pages) Bi technologies – Thick Film Chip Resistor Arrays

Thick Film Chip Arrays
BCN Series
Solder pad layout (Inch / mm)
BCN 10
L
P
P1
A
Y
B
X
X1
BCN 10
P
P1
A
B
X
X1
Y
L
.024
.020
.020 ±.004
.060 ±.004
010 ±.004
.018 ±.004
.020 ±.004
.085 ±.004
0.60
0.50
0.50 ±0.10 1.50 ±0.10 0.25 ±0.15 0.45 ±0.10 0.50 ±0.10 2.15 ±0.10
BCN 21
L
C
W2
W3
W1
A
B
Y
W
P
X
BCN 21
P
A
B
C
X
.032 .060 ±.008 .120 ±.008 .016 ±.004 .016 ±.004
0.80 1.20 ±0.20 3.00 ±0.20 0.40 ±0.10 0.40 ±0.10
Y
.030 ±.004
0.75 ±0.10
W
.012 ±.001
0.31 ±0.02
W1
.015 ±.004
0.38 ±0.10
W2
.030 ±.004
0.75 ±0.10
W3
L
.030 ±.004 .196 ±.008
0.75 ±0.10 4.98 ±0.20
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
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BI Technologies IRC Welwyn
www.ttelectronicsresistors.com
04.16