BCN Datasheet, PDF (6/9 Pages) Bi technologies – Thick Film Chip Resistor Arrays

Thick Film Chip Arrays
BCN Series
Solder pad layout (Inch / mm)
BCN 31 Only
BCN 16 4AB, 4ABI
Y
A
B
Y
BCN 4D/4DBI
BCN 16 4A,
AB, ABI
BCN 31 8R, 8S
C
X
P
Wave Solder Process
Re-flow Solder Process
P
A
B
C
X
Y
A
B
C
X
Y
.050
.087
.169
.022
.028
.041
.087
.154
.022
.028
.034
1.27
2.20
4.30
0.57
0.70
1.05
2.20
3.90
0.57
0.70
0.85
.032
.039
.118
.014
.018
.039
.039
.118
.014
.018
.039
0.80
1.00
3.00
0.35
0.45
1.00
1.00
3.00
0.35
0.45
1.00
.050
.084
.148
.014
.036
.032
.084
.148
.014
.036
.032
1.27
2.10
3.70
0.35
0.90
0.80
2.10
3.70
0.35
0.90
0.80
BCN 16 8RB / 8SB
A
P
Y
B
Y
X
Wave Solder Process
P
A
B
X
X1
Y
.025
.048
.096
.012
.018
.024
BCN 16 8RB / 8SB
0.64
1.20
2.40
0.30
0.45
0.60
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
X1
Re-flow Solder Process
A
B
X
X1
Y
.048
.096
.012
.018 .024
1.20
2.40
0.30
0.45 0.60
BI Technologies IRC Welwyn
www.ttelectronicsresistors.com
04.16