TS8314 Datasheet, PDF (16/28 Pages) Taiwan Semiconductor Company, Ltd – Bi-directional N-Channel 2.5V Specified MicroSURF™

Material Properties Used for Analysis
Material
FR4
Copper Layers (2 oz.)
Solder (96.8Sn/2.6Ag/.6Cu)
Silicon
Via (Composite of Cu and Epoxy)
Thickness (mm)
1.60000
0.07120
0.27000
0.64000
See model
K (W/m°C)
2.5
390
50
150
210
NOTE: 1. Values obtained from http://www.boulder.nist.gov/div853/lead%20free/part2.htm
2. Solder thermal conductivity is best conservative estimate based on composition
Model: Taiwan Semiconductor TS8314 Part
GWS8314 Thermal Analysis
16
8/15/03 Rev3