TS8314 Datasheet, PDF (12/28 Pages) Taiwan Semiconductor Company, Ltd – Bi-directional N-Channel 2.5V Specified MicroSURF™

Dimensional Outline and Pad Layout
PRELIMINARY DATA SHEET
S1 S1 G2
S2 S2 S2
S1 S1 S1
G1 S2 S2
Ø 0.25mm
Solder Mask Ø ~ 0.35mm
D = Drain Pad
S = Source Pad
G = Gate Pad
0.50mm
0.50mm
LAND PATTERN
RECOMMENDATION
831XXX
MARK ON BACKSIDE OF DIE
XXX = Date/Lot Traceability Code
12
8/15/03 Rev3