TGS4305-FC Datasheet, PDF (9/11 Pages) TriQuint Semiconductor – 60-90 GHz SP3T Switch Flip Chip

Mechanical Drawing
Drawing is for chip face up
TGS4305-FC
Units: millimeters (inches)
Thickness: 0.380 (0.015). Die x,y size tolerance: +/- 0.050 (0.002)
Chip edge to pillar dimensions are shown to center of pillar
Pillar # 1
RF IN
0.075 Ф
Pillar # 5
RF OUT 1
0.075 Ф
Pillar # 10
RF OUT 2
0.075 Ф
Pillar # 15
RF OUT 3
0.075 Ф
Pillar # 7
Vd1
0.075 Ф
Pillar # 12
Vd2
0.075 Ф
Pillar # 13
Vd3
0.075 Ф
Pillar # 8
DC Ground
0.075 Ф
Pillar # 2, 4, 6, 9, 11, 14, 16, 17
RF CPW Ground
0.075 Ф
Pillar # 3
Mechanical Support Only
0.075 Ф
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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November 2009 © Rev B