TGS4305-FC Datasheet, PDF (11/11 Pages) TriQuint Semiconductor – 60-90 GHz SP3T Switch Flip Chip

TGS4305-FC
Assembly Notes
Component placement and die attach assembly notes:
• Vacuum pencils and/or vacuum collets are the preferred method of pick up.
• Air bridges must be avoided during placement.
• Cu pillars on die are 65 um tall with a 22 um tall Sn solder cap.
• Recommended board metallization is evaporated TiW followed by nickel/gold at pillar attach interface. Ni is the adhesion layer for
the solder and the gold keeps the Ni from oxidizing. The Au should be kept to a minimum to avoid embrittlement; suggested Au /
Sn mass ratio must not exceed 8%.
• Au metallization is not recommended on traces due to solder wicking and consumption concerns. If Au traces are used, a physical
solder barrier must be applied or designed into the pad area of the board. The barrier must be sufficient to keep the solder from
undercutting the barrier.
Reflow process assembly notes:
• Minimum alloying temperatures 245 ˚C.
• Repeating reflow cycles is not recommended due to Sn consumption on the first reflow cycle.
• An alloy station or conveyor furnace with an inert atmosphere such as N2 should be used.
• Dip copper pillars in “no-clean flip chip” flux prior to solder attach. Suggest using a high temperature flux. Avoid exposing entire
die to flux.
• If screen printing flux, use small apertures and minimize volume of flux applied.
• Coefficient of thermal expansion matching between the MMIC and the substrate/board is critical for long-term reliability.
• Devices must be stored in a dry nitrogen atmosphere.
• Suggested reflow will depend on board material and density.
See Triquint Application Note for flip-chip soldering process: TBD
Typical Reflow Profiles for TriQuint Cu / Sn Pillars
Process
Ramp-up Rate
Flux Activation Time and Temperature
Time above Melting Point (245 ˚C)
Max Peak Temperature
Time within 5 ˚C of Peak Temperature
Ramp-down Rate
Sn Reflow
3 ˚C/sec
60 – 120 sec @ 140 – 160 ˚C
60 – 150 sec
300 ˚C
10 – 20 sec
4 – 6 ˚C/sec
Ordering Information
Part
TGA4305-FC
Package Style
GaAs MMIC Die
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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November 2009 © Rev B