TGS4305-FC Datasheet, PDF (10/11 Pages) TriQuint Semiconductor – 60-90 GHz SP3T Switch Flip Chip

TGS4305-FC
Recommended Assembly Diagram
TGS4305-FC SP3T data represented in this datasheet was
taken using co-planar waveguide (CPW) transition on the
shown substrate and ground-signal-ground probes.
Bypass capacitors not required.
Alumina substrate board
Thickness: 0.015 in.
ε_r = 9.9
RF OUT 1
Vd 1
RF IN
Vd 2
RF OUT 2
DC Ground
Vd 3
TGS4305-FC SP3T Die
RF OUT 3
Die is flip-chip soldered to substrate
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
10
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November 2009 © Rev B