TGS4310_15 Datasheet, PDF (8/9 Pages) TriQuint Semiconductor – 13-19GHz 5W SPDT Switch

TGS4310
13-19GHz 5W SPDT Switch
Mechanical Drawing and Bond Pad Description
2
1
3
5
4
Pin No.
1
2
3
4
5
Label
RFC
RF1
V_BIT
V_DD
RF2
Unit: millimeters
Thickness: 0.10
Die x, y size tolerance: +/- 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
Description
Common RF Port (Input); DC blocked
RF switched port 1 (Output 1); DC blocked
Control Voltage
Reference Voltage
RF switched port 2 (Output 2); DC blocked
Pad Size
0.100 x 0.206
0.206 x 0.100
0.100 x 0.100
0.100 x 0.100
0.206 x 0.100
Preliminary Datasheet: Rev - 07-18-14
© 2014 TriQuint
- 8 of 9 -
Disclaimer: Subject to change without notice
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