TGS4304_15 Datasheet, PDF (8/10 Pages) TriQuint Semiconductor – High Power Ka-Band Absorptive SPDT Switch

Chip Assembly & Bonding Diagram
VA
VB
May 2, 2008
TGS4304
RF Output A
RF Output B
RF Input
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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