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TGS4304_15 Datasheet, PDF (10/10 Pages) TriQuint Semiconductor – High Power Ka-Band Absorptive SPDT Switch | |||
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May 2, 2008
TGS4304
Assembly Process Notes
Reflow process assembly notes:
⢠Use AuSn (80/20) solder with limited exposure to temperatures at or above 300°C.
(30 seconds maximum)
⢠An alloy station or conveyor furnace with reducing atmosphere should be used.
⢠No fluxes should be utilized.
⢠Coefficient of thermal expansion matching is critical for long-term reliability.
⢠Devices must be stored in a dry nitrogen atmosphere.
Component placement and adhesive attachment assembly notes:
⢠Vacuum pencils and/or vacuum collets are the preferred method of pick up.
⢠Air bridges must be avoided during placement.
⢠The force impact is critical during auto placement.
⢠Organic attachment can be used in low-power applications.
⢠Curing should be done in a convection oven; proper exhaust is a safety concern.
⢠Microwave or radiant curing should not be used because of differential heating.
⢠Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes:
⢠Thermosonic ball bonding is the preferred interconnect technique.
⢠Force, time, and ultrasonics are critical parameters.
⢠Aluminum wire should not be used.
⢠Maximum stage temperature is 200°C.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
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