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TS3300 Datasheet, PDF (14/14 Pages) Touchstone Semiconductor Inc – 0.6-4.5VIN, 1.8-5.25VOUT, 3.5-uA, Low Input Voltage, High-Efficiency Boost + LDO
TS3300
PACKAGE OUTLINE DRAWING
16-Pin TQFN33 Package Outline Drawing
(N.B., Drawings are not to scale)
3.00 ± 0.05
0.75 ± 0.05
0.10 Ref.
Pin 1
Indicator
Dap Size 2x2
1.50 Ref.
CO.25
1.80 ± 0.05
1.80 ± 0.05
0.50 Ref.
0.25 ± 0.05
3.00 ± 0.05
0.25 Ref.
0.10 Ref.
1.50 Ref.
0.35 ± 0.05
Terminal Thickness
0.203 Ref.
Detail A : Terminal thickness for reference
only no measurement purpose
Detail A
0.0 – 0.05
0.0 – 0.05
Note:
1. All Dimensions are in mm
2 Compliant with JEDEC MO-220
Information furnished by Touchstone Semiconductor is believed to be accurate and reliable. However, Touchstone Semiconductor does not
assume any responsibility for its use nor for any infringements of patents or other rights of third parties that may result from its use, and all
information provided by Touchstone Semiconductor and its suppliers is provided on an AS IS basis, WITHOUT WARRANTY OF ANY KIND.
Touchstone Semiconductor reserves the right to change product specifications and product descriptions at any time without any advance
notice. No license is granted by implication or otherwise under any patent or patent rights of Touchstone Semiconductor. Touchstone
Semiconductor assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using Touchstone Semiconductor components. To minimize the risk associated with customer products and applications,
customers should provide adequate design and operating safeguards. Trademarks and registered trademarks are the property of their
respective owners.
Page 14 Touchstone Semiconductor, Inc.
630 Alder Drive, Milpitas, CA 95035
+1 (408) 215 - 1220 ▪ www.touchstonesemi.com
TS3300DS r1p0
RTFDS