TLP2166A Datasheet, PDF (9/11 Pages) Toshiba Semiconductor – PHOTOCOUPLER GaAℓAs Ired & PHOTO-IC

TLP2166A
Precautions Of Surface Mounting Type Photocoupler Soldering & General Storage
(1) Precautions for Soldering
1) When Using Soldering Reflow
z An example of a temperature profile when Sn-Pb eutectic solder is used:
z An example of a temperature profile when lead(Pb)-free solder is used:
z Reflow soldering must be performed once or twice.
z The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z Apply preheating of 150 deg.C for 60 to 120 seconds.
z Mounting condition of 260 deg.C or less within 10 seconds is recommended.
z Flow soldering must be performed once
3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds
not exceeding 350 deg.C.
z Heating by soldering iron must be only once per 1 lead
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2008-11-27