TMP1962F10AXBG Datasheet, PDF (70/108 Pages) Toshiba Semiconductor – 32-Bit RISC Microprocessor

TMP1962F10AXBG
4. Electrical Characteristics
The letter x in equations presented in this chapter represents the cycle period of the fsys clock selected
through the programming of the SYSCR1.SYSCK bit. The fsys clock may be derived from either the
high-speed or low-speed crystal oscillator. The programming of the clock gear function also affects the fsys
frequency. All relevant values in this chapter are calculated with the high-speed (fc) system clock
(SYSCR1.SYSCK = 0) and a clock gear factor of 1/fc (SYSCR1.GEAR[1:0] = 00).
4.1 Absolute Maximum Ratings
Parameter
Supply voltage
Input voltage
Low-level output
current
Per pin
Total
High-level output
current
Per pin
Total
Power dissipation (Ta = 85°C)
Soldering temperature (10 s)
Storage temperature
Operating
temperature
Write/erase cycles
Except during flash
W/E
During flash W/E
Symbol
V_CC2 (Core)
V_CC3 (I/O)
AVCC (A/D)
FVCC3 (L1 Pin)
V_IN
I_OL
ΣI_OL
I_OH
ΣI_OH
PD
T_SOLDER
T_STG
T_OPR
N_EW
Rating
−0.3 to 3.6
−0.3 to 4.0

−0.3 to 3.6

−0.3 to 4.0

−0.3 to V_CC + 0.3
5
50
−5
50
600
260
−65 to 150
−20 to 85
10 to 60
100
V_CC2 = DVCC21 = DVCC22 = FVCC2 = CVCC2, V_CC3 = DVCC3n (n = 1 to 4),
AVCC = AVCC31 = AVCC32, V_SS = DVSS = FVSS = AVSS = CVSS
Unit
V
V
mA
mW
°C
°C
°C
cycle
Note:
Absolute Maximum Ratings are limiting values of operating and environmental conditions which
should not be exceeded under the worst possible conditions. The equipment manufacturer should
design so that no Absolute Maximum Ratings value is exceeded with respect to current, voltage,
power dissipation, temperature, etc. Exposure to conditions beyond those listed above may cause
permanent damage to the device or affect device reliability, which could increase potential risks of
personal injury due to IC blowup and/or burning.
TMP1962F-69
2006-02-21