TLP3312 Datasheet, PDF (7/8 Pages) Toshiba Semiconductor – Battery Control Measuring Instruments Logic IC Testers / Memory Testers

2．Packing
TLP3312
Please use the device in a condition of the following because package breaking may occur when the USOP
coupler catches the heat stress in the time of soldering in the state that exposure to moisture in the air.
1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After the moisture-proof bag has been opened, the devices should be assembled within 168 hours in an
environment of 5°C to 30°C/70% RH or below.
3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color
changes to pink) or the expiration date has passed, the devices should be baked while packed in the tape reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60 ±5°C, for 64 to 72 hours.
Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label.
4. Repeated baking may cause the peeling strength of the tape to change, leading to trouble in mounting. Also, be
sure to prevent damage to the device from static electricity during the baking process.
5. Any breakage in the laminate packing material will cause the hermetically of the product to deteriorate. Do
not toss or drop the packed devices.
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2014-09-01