TLBF1108A Datasheet, PDF (6/12 Pages) Toshiba Semiconductor – General Lighting

TLBF1108A(T11
10. Mounting Method
10.1. Precautions when Mounting
• Do not apply force to the plastic part of the LED under high-temperature conditions.
• To avoid damaging the LED plastic, do not apply friction using a hard material.
• When installing the PCB in a product, ensure that the device does not come into contact with other
cmponents.
• For this product, silicone is used as the encapsulated material. Therefore the top surface of this product is
soft. Please do not stress on the encapsulated part of LEDs to avoid affecting the reliability of the product.
When using the mounting devices, please use the picking up nozzle that does not affect the silicone resin.
10.2. Soldering
Following show examples of reflow soldering.
• Temperature Profile (see following figures.)
Fig. 10.2.1 Temperature Profile for Pb Soldering Fig. 10.2.2 Temperature Profile for Lead(Pb)-free
(Example)
Soldering (Example)
• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed
the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering
under the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 4
weeks of opening the package.
• If a second reflow process is necessary, reflow soldering should be performed within 168 hours of the first
reflow under the above conditions. Storage conditions before the second reflow soldering: 30, 60% RH
(max)
• Do not perform wave soldering.
• Manual soldering with a soldering iron should meet the following conditions:
Temperature at tip of iron: 300 (max)
Soldering iron capacity: 25 W
Time: 3 seconds (max) (only once at each soldering point)
6
2012-02-24
Rev.2.0