CMZB27 Datasheet, PDF (3/5 Pages) Toshiba Semiconductor – TOSHIBA Zener Diode Silicon Diffused Type

Marking
Abbreviation Code
B12
B13
B15
B16
B18
B20
B22
B24
B27
Part No.
CMZB12
CMZB13
CMZB15
CMZB16
CMZB18
CMZB20
CMZB22
CMZB24
CMZB27
Abbreviation Code
B30
B33
B36
B39
B43
B47
B51
B53
Part No.
CMZB30
CMZB33
CMZB36
CMZB39
CMZB43
CMZB47
CMZB51
CMZB53
Standard Soldering Pad
Unit: mm
CMZB12~CMZB53
1.4
3.0
1.4
Handling Precaution
1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,even
for a moment. Do not exceed any of these ratings. The following are the general derating methods that we
recommend when you design a circuit with a device.
P:
We recommend that the worst case power dissipation be no greater than 50% of the
absolute maximum rating of power dissipation. Carry out adequate heat design.
P_RSM: We recommend that a device be used within the recommended area in the figure,
P_RSM-tw.
T_j:
Derate this rating when using a device in order to ensure high reliability.
We recommend that the device be used at T_j of below 120°C.
2) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.
When using a device, design a circuit board and a soldering land size to match the appropriate thermal
resistance value.
3) Please refer to the Rectifiers databook for further information.
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2013-11-01