TLP106_07 Datasheet, PDF (2/6 Pages) Toshiba Semiconductor – PHOTO-IC Intelligent Power Module Signal Isolation

TLP106
Recommended Operating Conditions
CHARACTERISTIC
Input Current, ON
Input Voltage, OFF
Supply Voltage
Operating Temperature
SYMBOL
IF (ON)
VF (OFF)
VCC
Topr
MIN.
5
0
4.5
-40
TYP.
―
―
―
―
MAX.
10
0.8
20
85
UNIT
mA
V
V
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Absolute Maximum Ratings (Ta = 25°C)
CHARACTERISTIC
Forward Current
Peak Transient Forward Current (Note 1)
Reverse Voltage
Output Current 1 (Ta ≤ 25°C)
Output Current 2 (Ta = 85°C)
Peak Output Current
Output Voltage
Supply Voltage
Operating Temperature Range
Storage Temperature Range
Lead Solder Temperature (10 s)
Isolation Voltage
(AC, 1 min., R.H. ≤60%,Ta = 25°C) (Note2)
SYMBOL RATING
IF
20
IFPT
1
VR
5
IO1
15/-15
IO2
4.5/-4.5
IOP
20/-20
VO
-0.5~20
VCC -0.5~20
Topr
-40~85
Tstg
-55~125
Tsol
260
BVs
3750
UNIT
mA
A
V
mA
mA
mA
V
V
°C
°C
°C
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width PW ≤ 10 us, 500 pps.
Note 2: Product considered a two-terminal device: pins 1 and 3 shorted together and pins 4, 5 and 6 shorted
together.
2
2007-10-01