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SSM3J46CTB Datasheet, PDF (2/6 Pages) Toshiba Semiconductor – Power Management Switch Applications
SSM3J46CTB
Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Conditions
Min Typ. Max Unit
Drain-Source breakdown voltage
Drain cut-off current
Gate leakage current
Gate threshold voltage
Forward transfer admittance
Drain–source ON-resistance
Input capacitance
Output capacitance
Reverse transfer capacitance
Switching time
Turn-on time
Turn-off time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Drain-Source forward voltage
V (BR) DSS ID = −1 mA, VGS = 0 V
−20
⎯
⎯
V
V (BR) DSX ID = −1 mA, VGS = 5 V
(Note 3) −15
⎯
⎯
V
IDSS VDS = −20 V, VGS = 0 V
⎯
⎯
−1
μA
IGSS VGS = ±8 V, VDS = 0 V
⎯
⎯
±1
μA
Vth
VDS = −3 V, ID = −1 mA
−0.3
⎯ −1.0
V
⏐Yfs⏐ VDS = −3 V, ID = −1.0 A
(Note 2) 2.6
5.2
⎯
S
ID = -1.5 A, VGS = −4.5 V
(Note 2) ⎯ 88.5 103
RDS (ON) ID = -1.0 A, VGS = −2.5 V
ID = -0.5 A, VGS = −1.8 V
(Note 2) ⎯ 107.5 133
mΩ
(Note 2) ⎯
130 178
ID = -0.25 A, VGS = −1.5 V (Note 2) ⎯
151 250
Ciss
Coss
Crss
VDS = −10 V, VGS = 0 V
f = 1 MHz
⎯
290
⎯
⎯
44
⎯
pF
⎯
32
⎯
ton
VDD = −10 V, ID = −0.5 A
toff
VGS = 0 to −2.5 V, RG = 4.7 Ω
⎯ 13.4 ⎯
ns
⎯ 46.2 ⎯
Qg
Qgs
VDD = −10 V, IDS = −2.0 A,
VGS = − 4.5 V
Qgd
⎯
4.7
⎯
⎯
3.7
⎯
nC
⎯
1.0
⎯
VDSF ID = 2.0 A, VGS = 0 V
(Note 2) ⎯
0.9 1.2
V
Note2: Pulse test
Note3: VDSX mode (the application of a plus voltage between gate and source) may cause decrease in maximun
rating of drain-source voltage
Switching Time Test Circuit
(a) Test Circuit
0
IN
−2.5V
10 μs
OUT
RL
VDD
(b) VIN
0V
−2.5 V
VDS (ON)
10%
90%
90%
VDD = -10 V
RG = 4.7 Ω
Duty ≤ 1%
VIN: tr, tf < 5 ns
Common Source
Ta = 25°C
10%
VDD
t
tf
ton
toff
Notice on Usage
Vth can be expressed as the voltage between gate and source when the low operating current value is ID = -1 mA for
this product. For normal switching operation, VGS (on) requires a higher voltage than Vth and VGS (off) requires a lower
voltage than Vth. (The relationship can be established as follows: VGS (off) < Vth < VGS (on).)
Take this into consideration when using the device.
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that
come into direct contact with devices should be made of antistatic materials.
2
2009-09-28