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HN2E04F Datasheet, PDF (2/8 Pages) Toshiba Semiconductor – MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application | |||
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Q1 (Transistor) Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test
Circuit
Test Condition
Collector cut-off current
Emitter cut-off current
DC current gain
Collector-emitter saturation voltage
Transition Frequency
Collector Output Capacitance
Noise figure
ICBO
IEBO
hFE*
VCE(sat)
fT
Cob
NF
â VCB = â120V, IE = 0
â VEB = â5V, IC = 0
â VCE =â 6V, IC = â2mA
â IC =â10mA, IB =â1mA
â VCE = â6V, IC =â1mA
â VCB =â10V, IE = 0,f=1MHz
VCE = â6 V, IC = â0.1 mA
â
f = 1 kHz,Rg = 10 kΩ
*: hFE Classifications GR(G):200~400 , BL(L):350~700 ( )Marking Symbol
HN2E04F
Min Typ. Max Unit
â
â â100 nA
â
â â100 nA
200
â
700
â
â â0.3 V
â
100
â MHz
â
4
â
pF
â
1.0
â
dB
Q2 (Diode) Electrical Characteristics (Ta = 25°C)
Characteristic
Forward voltage
Reverse current
Total capacitance
Reverse recovery time
Symbol
VF (1)
VF (2)
VF (3)
IR (1)
IR (2)
CT
trr
Test
Circuit
Test Condition
â IF = 1mA
â IF = 10mA
â IF = 100mA
â VR = 30V
â VR = 80V
â VR = 0, f = 1MHz
â IF = 10mA (fig.1)
Min Typ. Max Unit
â 0.62 â
â 0.75 â
V
â 0.98 1.20
â
â
0.1
μA
â
â
0.5
â
0.5
â
pF
â
1.6
â
ns
Marking
Type Name
32G
hFE RANK
Equivalent Circuit (Top View)
654
Q1
Q2
123
2
2007-11-22
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