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HN2E04F Datasheet, PDF (2/8 Pages) Toshiba Semiconductor – MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application
Q1 (Transistor) Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test
Circuit
Test Condition
Collector cut-off current
Emitter cut-off current
DC current gain
Collector-emitter saturation voltage
Transition Frequency
Collector Output Capacitance
Noise figure
ICBO
IEBO
hFE*
VCE(sat)
fT
Cob
NF
― VCB = −120V, IE = 0
― VEB = −5V, IC = 0
― VCE =− 6V, IC = −2mA
― IC =−10mA, IB =−1mA
― VCE = −6V, IC =−1mA
― VCB =−10V, IE = 0,f=1MHz
VCE = −6 V, IC = −0.1 mA
―
f = 1 kHz,Rg = 10 kΩ
*: hFE Classifications GR(G):200~400 , BL(L):350~700 ( )Marking Symbol
HN2E04F
Min Typ. Max Unit
―
― −100 nA
―
― −100 nA
200
―
700
―
― −0.3 V
―
100
― MHz
―
4
―
pF
―
1.0
―
dB
Q2 (Diode) Electrical Characteristics (Ta = 25°C)
Characteristic
Forward voltage
Reverse current
Total capacitance
Reverse recovery time
Symbol
VF (1)
VF (2)
VF (3)
IR (1)
IR (2)
CT
trr
Test
Circuit
Test Condition
― IF = 1mA
― IF = 10mA
― IF = 100mA
― VR = 30V
― VR = 80V
― VR = 0, f = 1MHz
― IF = 10mA (fig.1)
Min Typ. Max Unit
― 0.62 ―
― 0.75 ―
V
― 0.98 1.20
―
―
0.1
μA
―
―
0.5
―
0.5
―
pF
―
1.6
―
ns
Marking
Type Name
32G
hFE RANK
Equivalent Circuit (Top View)
654
Q1
Q2
123
2
2007-11-22