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2SJ680_09 Datasheet, PDF (2/6 Pages) Toshiba Semiconductor – Switching Applications | |||
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2SJ680
Electrical Characteristics (Ta = 25°C)
Characteristic
Gate leakage current
Drain cutoff current
Drain-source breakdown voltage
Gate threshold voltage
Drain-source ON-resistance
Forward transfer admittance
Input capacitance
Reverse transfer capacitance
Output capacitance
Rise time
Switching time
Turn-on time
Fall time
Turn-off time
Total gate charge
(gate-source plus gate-drain)
Gate-source charge
Gate-drain (âMillerâ) charge
Symbol
Test Condition
Min Typ. Max Unit
IGSS
IDSS
V (BR) DSS
Vth
RDS (ON)
âªYfsâª
Ciss
Crss
Coss
VGS = ±16 V, VDS = 0 V
VDS = â200 V, VGS = 0 V
ID = â10 mA, VGS = 0 V
VDS = â10 V, ID = â1 mA
VGS = â10 V, ID = â1.5 A
VDS = â10 V, ID = â1.5 A
VDS = â10 V, VGS = 0 V, f = 1 MHz
â¯
â¯
±10
μA
â¯
⯠â100 μA
â200 â¯
â¯
V
â1.5
â¯
â3.5
V
â¯
1.6 2.0
Ω
1.0 2.0
â¯
S
⯠410 â¯
â¯
40
â¯
pF
⯠145 â¯
tr
0V
VGS
ton
â10 V
ID = â1.5 A VOUT
â¯
20
â¯
â¯
45
â¯
RL = 66.7 Ω
ns
tf
â¯
15
â¯
VDD â â100 V
toff
Duty ⤠1%, tw = 10 μs
â¯
85
â¯
Qg
VDD â â160 V, VGS = â10 V,
Qgs
ID = â2.5 A
Qgd
â¯
10
â¯
â¯
6
â¯
nC
â¯
4
â¯
Source-Drain Ratings and Characteristics (Ta = 25°C)
Characteristic
Continuous drain reverse current (Note 1)
Pulse drain reverse current
(Note 1)
Forward voltage (diode)
Reverse recovery time
Reverse recovery charge
Symbol
IDR
IDRP
VDSF
trr
Qrr
Test Condition
â¯
â¯
IDR = â2.5 A, VGS = 0 V
IDR = â2.5 A, VGS = 0 V,
dIDR/dt = 100 A/μs
Min Typ. Max Unit
â¯
â¯
â2.5
A
â¯
â¯
â10
A
â¯
â¯
2.0
V
â¯
135
â¯
ns
⯠0.81 â¯
μC
Marking
J680
Part No. (or abbreviation code)
Lot No.
Note 4
Note 4: A line under a Lot No. identifies the indication of product
Labels.
Not underlined: [[Pb]]/INCLUDES > MCV
Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
Please contact your TOSHIBA sales representative for details as to
environmental matters such as the RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament
and of the Council of 27 January 2003 on the restriction of the use of
certain hazardous substances in electrical and electronic equipment.
2
2009-09-29
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