BQ24165_14 Datasheet, PDF (9/38 Pages) Texas Instruments – 2.5A, Dual-Input, Single Cell Switch Mode Li-Ion Battery Charger with Power Path Management

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bq24165
bq24166
bq24167
SLUSAP4B – DECEMBER 2011 – REVISED MARCH 2013
PIN
NAME
DRV
BAT
TS
CHG
ISET
Thermal
Pad
PIN FUNCTIONS (continued)
PIN NUMBER
bq24165
bq24166/7
YFF RGE YFF
RGE
F7
6
F7
6
G1–G4 11, 12 G1–G4 11, 12
–
–
G5
9
G6
8
G6
8
G7
5
G7
5
–
Pad
–
Pad
I/O
DESCRIPTION
Gate Drive Supply. DRV is the bias supply for the gate drive of the internal
O
MOSFETs. bypass DRV to PGND with a 1μF ceramic capacitor. DRV may be
used to drive external loads up to 10mA. DRV is active whenever the input is
connected and V_SUPPLY > V_UVLO and V_SUPPLY > (V_BAT + V_SLP)
I/O
Battery Connection. Connect to the positive terminal of the battery.
Additionally, bypass BAT to GND with at least a 1μF capacitor.
Battery Pack NTC Monitor. Connect TS to the center tap of a resistor divider
from DRV to GND. The NTC is connected from TS to GND. The TS function
I
in the bq24166 provides 2 thresholds for Hot/ Cold shutoff, while the bq24167
has 2 additional thresholds for JEITA compliance. See the NTC Monitor
section for more details on operation and selecting the resistor values.
Connect TS to DRV to disable the TS function.
Charge Status Open Drain Output. CHG is pulled low when a charge cycle
O
starts and remains low while charging. CHG is high impedance when the
charging terminates and when no supply exists. CHG does not indicate
recharge cycles.
Charge Current Programming Input. Connect a resistor from ISET to GND to
I program the fast charge current. The charge current is programmable from
550mA to 2.5A.
There is an internal electrical connection between the exposed thermal pad
and the PGND pin of the device. The thermal pad must be connected to the
– same potential as the PGND pin on the printed circuit board. Do not use the
thermal pad as the primary ground input for the device. PGND pin must be
connected to ground at all times.
Copyright © 2011–2013, Texas Instruments Incorporated
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